System Level Test For Automotive Devices - A Thermal . PDF

1m ago
2 Views
0 Downloads
1.71 MB
28 Pages
Transcription

Session 7TestConX 2020Presentation 4Heating Up - ThermalSystem Level Testfor Automotive Devices A Thermal PerspectiveSee Jean “Sid” ChanWee Tick LoAEM SingaporeVirtual Event May 11-13, 2020TestConX Workshopwww.testconx.orgMay 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalContents Challenges of Automotive Device Testing AEM’s Approach To Address The Challenges Summary & ClosingSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org2May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalChallenges With Automotive Testing Increase in the number ofcomponents and complexity. Mission critical applications withzero tolerance for error. From Defects per Million toDefects per BillionSource : ResearchgateAdvanced Driver Assistance SystemsAutomotive industry demands extended reliability on parts.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org3May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalChallenges With Automotive TestingAdvanced semiconductor process nodes The Auto industry is now driving the need fornew process nodes. ADAS parts are nowmoving to 7nm and below. In the past automotive parts took advantage ofmature process nodes. The automotive industry now demands sametime to market and Semiconductor process asother leading edge technologiesSource: Qualcomm Mike CampbellProcess NodeNumber of TransistorsGap in Test CoverageSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org4May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalChallenges With Automotive TestingComponent design EDA and DFT tools are not adequate to detect today’sfailures, and designs have reduced margins. More transistors increase challenge to detect thermalrelated failuresSource : AMDManufacturing assembly New package technologies are more sophisticated withnew fault modes. Parts are subject to more rigorous environments withextended temperature ranges.2D, 2.5D, 3D package technologiesSemiconductor parts are getting more complex and more thermal sensitive.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org5May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalSystem Level Test ParadigmA new test methodology System level test is becoming a mainstream test to simulate the final application environment. System level test times tend to be longer than traditional test flows (minutes vs. seconds) to enablethe ability to catch additional defects and validate process corners. To enable system test as a cost effective solution requires high levels of parallelism. Thermal stress testing and thermal management during test is an important parameter for testingdevice corners and device margins. Thermal solutions now need to support per site thermal management on highly parallel systemsSystem Level Test with high parallelism and thermal management.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org6May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalOur Approach to Address The Challenges1. Modular, Massively Parallel2. Scalable Active Thermal Control SolutionSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org7May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalWhy Modular, Massively Parallel System? Good utilization of handler time Typically SLT is long. Traditional One Tester-to-One Handler model is leaving the handler idle most of the time. Many Testers-to-One Handler concept can better utilize the handler time. Highly scalable Modular design allows the system to scale up quickly. Effective utilization of resources Highly parallel system with asynchronous operation allows effective sharing of resources.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org8May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalConcept of Configurable Test Unit A CTU includes hardware and software required for test. Each CTU operates as a complete asynchronous system. CTU is designed to support a wide range of test temperatures.Thermal ControllerThermal Heads w/ ActuationTest Controller & Power SuppliesSystem Level Test BoardsSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org9May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalConcept of Configurable Test Unit CTUs are attached to a single handler. A Many Testers-to-One Handlerconcept.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org10May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalHow this helps in Time to Market ? Reduce Insertions - Multiple test processes within a single Insertion. Rapid Scale Up - Minimize correlation effort from engineering to production.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org11May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalReduce InsertionsTri-temp enabled CTU allows test at different temperatures to happen in singleinsertion.150 CCTU-40 CSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org12May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalRapid Scale UpSame hardware and software are used from Engineering to Production.Minimized correlation effort.LabFabConfigurable Test UnitCost EffectiveDevelopment Tool(Up to 16 sites)Low Cost Engineering SystemFor Samples (Low Volume)SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.orgHigh Volume ManufacturingWith Automated Handling(96 to 480 sites)13May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalChallenges to be solved for Scalable Thermal SolutionObjective: to develop a scalable active thermal control solution fora. -40 C to 150 C test temperature.b. Supports 100s of DUTs (a massively parallel system).c. Each DUT operates independently (active control per DUT).Available cooling technologies for us.a. Thermoelectric coolingb. Liquid coolingSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org14May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalThermoelectric Cooling ScalabilityHot SideHeat DissipationCoolAir / WaterElectric PowerHeat SinkWarmAir / WaterTEMDUTNote:TEM : Thermoelectric ModuleDUT : Device Under TestCold SideHeat RemovalHot side power Cold side power electrical powerSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org15May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalThermoelectric Cooling ScalabilityCase StudyThermoelectric Cooler SpecΔT at 56 C10WCoolingNumber of Stage : 2Dimension : 40x40mmHot Side Temperature : 15 C (with Water cool)Cold Side Temperature : -40 C80WHeatCOP @ -40 C3.6A3.6ANumber of DUTCooling PowerElectric PowerTotal 0W7,000W8,000W3003,000W21,000W24,000WSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org10W / 70W 0.1428COP: Coefficient of Performance16May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalThermoelectric Cooling ScalabilityWhat if we want to support higher power, let’s say 50W?TEM50WCoolingTEMTEMTEMTEMSingle TEM is unable to reach the ΔTthat we need for 50W DUT power.5x TEM on each DUT are required,5x more power, 5x larger in area.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org17May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalLiquid Cooling Scalability13kW ofElectric PowerCool Water In-60 CHFEChillerHeat load from insulated pipes approximately at 500WDUT #110W @ -40 CDUT #210W @-40 CDUT #[email protected] CDUT #[email protected] CDUT #[email protected] [email protected] CWarm Water OutA single 3.5kW chiller can supports 300x DUTs at 10W power @ -40 C test.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org18May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalLiquid Cooling Scalability – Chiller CapabilityHFE Chiller Spec5kW [email protected] -50 C3.5kW [email protected] -60 CProcess Fluid : NOVEC 7500Heat Removal : Chilled WaterCooling Capacity : 3.5kW @ -60 CFull Load Electric Power : 13kW @ 480VAC, 60HzEfficiency @ -60 C3.5kW / 13.5kW 0.2592Efficiency @ -50 C5kW / 13.5kW 0.37SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org19May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalLiquid Cooling ScalabilityWhat about 50W or beyond?13kW ofElectric PowerHeat load from insulated pipes approximately at 500W-60 CHFEChillerCool Water InDUT #150W @ 40 CDUT #250W @-40 CDUT #350W @-40 CDUT #5950W @-40 CDUT #[email protected] [email protected] CWarm Water OutThe same setup can support 60x DUT at 50W power @ -40 C without needingto change the hardware.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org20May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalLiquid Cooling [email protected] CLoadingHot TestCold TestCold TestRoomLoadingHot TestCold TestCold TestRoomLoadingHot TestCold TestCold TestRoomHot TestHot TestCold TestCold TestRoomHot TestHot TestCold TestCold TestRoomHot TestHot TestCold TestCold TestWaitingWhen CTUs run tri-temp test, each CTU starts at different times. Only partial of the CTUsare in peak consumption of cooling power at one time. Hence a single chiller can support alarge number of cells yet maintaining its best thermal control performance.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org21May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalTest Data – Liquid CoolingC--- Temperature Set Point--- DUT Temperature, TC--- DUT Power On/Off StatusHBDGEIFTemperatureTimeB-40 C to 125 C 30sD125 C to -40 C 25sE-40 C to 25 C 12sF25 C to -40 C 12sH125 C to 50 C 5sI50 C to -40 C 15sA50 W0W50 W0W50 W0W10 W20 W30 W40 W50 WNote: Above data is the test result specific to the test setup used in the test. The performance in production setup may varydepends on the design and other conditionsSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org22May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalTest Data – Liquid Cooling--- Temperature from Sensor inside the DUT--- Heat Load On/Off StatusInlet fluid temperature @ -52 C 1 C 3 C10 W20 W30 W40 W50 WLoad ONLoad OFFSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org23May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalThermal Solution Scalability – SizeThermoelectric CoolingTo bring the DUT case temperature to-40 C @ 50W DUT Power, we use 5xTEM of 50x50x7mm with water cooling.Liquid CoolingTo bring the DUT Junction Temperature to-40 C @ 50W DUT Power, we use a coldplate 50x50x10mm with -60 C HFE supply.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org24May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalThermal Scaling Challenges - ConclusionThermoelectric Cooling vs. Liquid Cooling ApplicationThermoelectric CoolStrengthLimitationSuitableApplication Excellent control accuracy No wear and tear Quite operationLiquid Cool High cooling power High efficiency Low power Overhead loss (pressure, heat load, etc) Limited ΔT (ambient to test point) Compressor noise Low efficiency when deal with high power Maintenance Low DUT power cooling Less number of sites Test above -15 C, or large TEC to supportlower temperature High DUT power cooling High number of parallel sites Test at -40 C and belowSLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org25May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalScalable Thermal Solution: Current and Future Developments Challenges managed– Compact solution allowing modular, independent, and asynchronous operation.– Scalable platform with extreme low temperature testing capability targeting automotiverequirements.– Centralized infrastructure to support test with higher DUT power. Challenges ahead & future development plan––––More and more DUT power!Wider temperature coverage and faster temperature swing.Temperature control for complex devices e.g. multi-zone temperature controlFurther enhance chiller’s efficiency.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org26May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalSummary & Closing System Level Test is the future of test for the automotive industry. Active thermal control can improve faults coverage of today’s complexpackages. Massive parallel system keeps the cost of test low. Liquid cool is an effective choice of solution for a highly parallel system for itsscalability.SLT for Automotive Devices - A Thermal PerspectiveTestConX Workshopwww.testconx.org27May 11-13, 2020

Session 7TestConX 2020Presentation 4Heating Up - ThermalCOPYRIGHT NOTICEThe presentation(s)/poster(s) in this publication comprise the proceedings of the 2020TestConX Virtual Event. The content reflects the opinion of the authors and theirrespective companies. They are reproduced here as they were presented at the 2020TestConX Virtual Event. The inclusion of the presentations/posters in this publicationdoes not constitute an endorsement by TestConX or the workshop’s sponsors.There is NO copyright protection claimed on the presentation/poster content byTestConX. However, each presentation/poster is the work of the authors and theirrespective companies: as such, it is strongly encouraged that any use reflect properacknowledgement to the appropriate source. Any questions regarding the use of anymaterials presented should be directed to the author(s) or their companies.“TestConX” and the TestConX logo are trademarks of TestConX. All rights reserved.www.testconx.orgTestConX Workshopwww.testconx.orgMay 11-13, 2020

SLT for Automotive Devices -A Thermal Perspective 6 System Level Test Paradigm System Level Testwith high parallelismand thermal management. TestConX 2020 Heating Up -Thermal Session 7 Presentation 4 TestConX Workshop www.testconx.org May 11-13, 2020 SLT for Automotive Devices -A Thermal Perspective 7 Our Approach to Address The Challenges 1. Modular, Massively Parallel 2. Scalable Active ...